Materials

Nanotronix has developed a seed layer(3D) for making a through-hole electrode in TGV substrate, which is said to be the most difficult in semiconductor glass core substrates, through plating, and has developed all the related plating chemicals in-house.

In addition, glass surface plating(2D) is also available, and it is expected to have a wide range of applications in the display.

We are also continuously developing materials along with process development in the application of heat-dissipating coating, acid-resistant coating, and ink printing, etc.

TGV metallization chemicals made by Nanotronix

Nanotronix has developed various ultra-precision pattern operations based on glass substrates, which are gaining attention as key materials in semiconductors and displays.

We have accumulated various know-hows through glass molding, surface treatment, precision processing, and patterning operations of glass substrates, and are constantly striving to meet the needs of 2D/3D fine patterns required in semiconductor devices through TSV/TGV metallization, TFT patterning, and glass surface patterning.

In particular, we are responding to AI demands by developing various pattern chemicals that are suitable for the characteristics of glass substrates.

And we are also simultaneously conducting process development and system development according to new materials.

Why plating technology is needed when forming glass core (especially, seed process)

Deposition @ TGV Nanotronix wet solution Conventional dry type deposition
Via fill target
AR > 5:1		 Process development that are suitable for the characteristics of glass substrates and own chemical manufacturing Nanotronix wet solution Conventional dry type deposition
Plating seed & fill Sputtering seed & plating fill
Features (expected) High-AR available.
  • - Conformal step coverage : 70%+
  • - High Aspect Ratio(HAR) available : 10:1~20:1
 (performance level)
  • - Poor step coverage
  • - Poor AR : < 5:1(Generally not available 5:1~20:1)
Both Seed and Fill can be implemented using the plating method, and the high-AR (10~20) technology that overcomes the limitations of sputtering is attracting attention in the glass core(TGV) substrate market. A critical limitation of sputter technology that currently cannot reach high aspect ratios.
There are voids or seams inside the bottom and side walls of the via.